If you have questions about this program, email the
program leader listed below.
Semiconductors in Japan
Program Details
The arrangements for the travel, housing, meals, excursions and course content of
this program have been made by the leader. Questions about this program can only be
answered by the program leader listed below.
|
Program Type |
Departmental |
Program Location |
Tokyo, Sendai, Hiroshima , Japan
|
Course # |
SA 10524
|
Duration |
Summer
|
Upcoming Program Dates |
Summer 2024 |
05/05/24 to 05/18/24
|
Please Note: Programs may be altered or adapted with little notice
Enrollment Details: Enrollment Currently Closed
Program Description
Program organized by Cristina Farmus, VP Special Projects and Assistant Dean of Global Engineering, George Chiu.
Purdue University is a leader in semiconductor education. We are augmenting existing coursework and talent development programs with a pioneering course for semiconductors in Japan. The location was chosen based on the partnership Purdue signed with 5 Japanese Universities as part of the UPWARDS program. Purdue President Mung Chiang signed a landmark international agreement, partnering with Micron, Tokyo Electron, and other educational institutions in the United States and Japan to establish the “UPWARDS Network” for workforce advancement and research and development in semiconductors. The universities and companies we plan to visit are part of the UPWARDS Network and will provide excellent semiconductor content and visits for our students to help them learn more about this industry and technical advancements.
Students will be traveling across Japan visiting university and industry partners.
Proposed Itinerary: Subject to change!
May 5- Depart the USA
May 6- Arrive Tokyo, check into hotel, free evening
May 7-Visit Tokyo University, Welcome dinner
May 8-Visit Tokyo Electron Company, cultural activity, free evening
May 9-Western Digital, travel to Sendai, Tohoku University
May 10-Tohoku visit, free evening
May 11-Travel to Hiroshima, cultural activity, free evening
May 12-Free day
May 13-Hiroshima University, free evening
May 14-Visit Micron, Higashihiroshima, travel to Osaka/Kyoto area, check into hotel, free evening
May 15-Visit Applied Materials, cultural activity such as Inari Shrine or Nijo Castle
May 16-Possible Western Digital Yokhaichi, free evening or additional cultural activity
May 17-Return to Tokyo, free time, Farewell Meal
May 18-Students free to leave any time
Academic Credit
Earn 2 credits for ENGR 49600. All students must check with their academic advisor to see how this course can be used in your plan of study.
Eligibility
Open to all Engineering students in good standing, Science, PPI, and Business. Preference given to students who have taken STARS or Introduction to Semiconductors in 2023 or plan to take these programs in 2024.
Program Cost
Students pursuing program participation accept financial responsibility. Purdue will take measures to mitigate financial risks, although will not be liable for loss.
Final cost is: $3,868. This includes: All hotels, ground transportation in Japan, Breakfast daily, Welcome and Farewell meals, all activities and cultural events on the itinerary, academic credits, and international health insurance.
Additional costs: Airfare, Passport, Visa (if required, not for US citizens), lunches and dinners, personal activities, and personal spending money.
Students will know final cost before a deposit is required later in December.
Application Deadline
20 spots available. Students will be accepted on a rolling basis until program reaches capacity.
Financial Aid
Purdue University financial aid may be applied to the costs of studying abroad. Students interested in receiving financial aid should
NOTE: Recipients of certain tuition remission and scholarship programs should pay careful attention to the regulations for using those benefits for study abroad. Ask your financial aid advisor about any limitations.
Click here for a list of scholarships and grants available to assist with the costs of studying overseas.